Zarfan’s Cyanide Copper Electroplating Solution is a high-performance alkaline electrolyte designed to produce a bright, uniform, and highly adhesive copper layer on base metals. Thanks to its excellent stability and conductivity, it serves as an ideal underlayer for nickel, gold, or rhodium plating. This advanced copper electrolyte allows for fast and controlled deposition, resulting in a smooth, crack-free, and mirror-bright finish. It is suitable for both rack and barrel plating systems, making it a trusted choice in electronics, jewelry, industrial components, and decorative applications.
Zarfan’s Cyanide Copper Electrolyte is engineered to deliver superior adhesion, conductivity, and brightness, making it an essential base layer for multi-step plating systems. It provides a clean, smooth, and uniform copper surface, ensuring excellent bonding and long-term stability for subsequent coatings such as nickel, gold, or rhodium. With consistent performance and easy control, this electrolyte is widely used by professional platers, jewelry makers, and electronics manufacturers seeking reliability and efficiency.
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